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Montage Technology Participates in Global (Shanghai) AI Innovation Summit 2017

SHANGHAI, China, Aug. 30, 2017 -- Montage Technology, a leading fabless semiconductor provider focusing on the data center and smart home entertainment markets, was invited to participate in Global (Shanghai) AI Innovation Summit 2017, demonstrating its Jintide™ server CPU and platform.

Jintide™ server CPU and platform integrates Intel Xeon® scalable processor and Reconfigurable Computing Processor (RCP) developed jointly by Tsinghua University and Montage Technology. By combining the general-purpose processor (i.e. Xeon®) with the programmable processor (i.e. RCP) in a single chip, Jintide™ server CPU and platform offers a new AI application oriented computing solution for high-performance servers, and is able to provide advanced Heterogeneous Multi-Processor and inter-connection technologies including Vector Computing Engine, Mesh on Chip Interconnect, and Parallel Reconfigurable Hardware Accelerator Engine, etc., which give powerful support for AI training and inference in terms of integrated data processing capability and computing power.

In addition, Jintide™ server CPU and platform can also incorporate Montage’s Hybrid-Security DIMM (HSDIMM™) for runtime hardware security checking and controlling so as to build a solid secure hardware foundation for the booming AI applications.

About Montage Technology

Montage Technology, a leading fabless semiconductor company, is committed to providing high-performance IC based solutions for cloud computing and artificial intelligent (AI) markets. Dedicated for more than 10 years in the memory interface technology, the company is the only vendor worldwide able to deliver fully-buffered and partially-buffered solutions from DDR2 to DDR5. Montage’s invention of DDR4 fully buffered “1+9” distributed architecture is adopted by JEDEC as an international standard, and its related products have successfully entered the industry mainstream memory, server and cloud computing fields and served the majority of the global market.

Since 2016, Montage has been cooperating with Intel and Tsinghua University to develop a secure and controllable CPU. A secure and controllable high-performance server-CPU platform combining with Montage’s hybrid security memory module (HSDIMM®) has been launched. The platform has realized real-time security monitoring at silicon level for the first time in the industry and can play a significantly important role in the information security field. This architecture also incorporates advanced heterogeneous processing and interconnect technologies for future AI and big data applications, which provides strong support of comprehensive data processing and computing power for various applications in the AI era.

Established in 2004, Montage Technology is headquartered in Shanghai and has branches in Kunshan, Macao, Silicon Valley of USA and Seoul of South Korea.

For more information regarding Montage please visit the Company's website at http://www.montage-tech.com.

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