职位描述
- Perform analog and mixed-signal physical design;
- Perform layout verification (DRC, LVS);
- Modify and verify in-house DRC & LVS command files.
岗位要求
- BS with experience in IC layout experience;
- Good understanding of basic electronic principles dealing with circuit and layout design;
- Familiar with IC layout methodologies and flows;
- Familiar with CAD tools such as Cadence virtuoso layout, PCELLs, Calibre physical verification;
- Familiar with Calibre DRC & LVS command files;
- Prior experience with stand-cell built is a plus.
职位描述
- Help develop next generation of solutions for advanced memory interfaces of data centers;
- Perform high speed SI simulation and analysis;
- Extraction of channel model using standard industry tools;
- Lab measurements of interconnect channel in frequency and time domains.
岗位要求
- MS in Electrical Engineering/Microwave/Physics/Computer Science/Math;
- Solid knowledge of Electromagnetic and Microwave;
- Experience in high speed SI/PI simulation and analysis;
- Mastering measurement tools like oscilloscope, VNA, TDR/TDT;
- Knowledge of a programming or scripting language in a Windows/UNIX environment;
- Excellent technical communication skills.
职位描述
- Develop system board for IC validation;
- Work on IC function verification and performance test;
- Develop evaluation board for demonstration and evaluation;
- Develop reference board for customer design;
- Support customers to facilitate their product development cycles.
岗位要求
- BSEE or MSEE with experience in hardware development;
- Experience in application development;
- Familiar with lab equipments, such as oscilloscope, spectrum analyzer, network analyzer, etc.
职位描述
- Participate new product qualification (ESD, LU Life test) per requirement;
- Complete correlation/char test and data analysis;
- New product induce to production.
岗位要求
- B.S Degree ,Major in Electronics/Electrical Engineering;
- Experience in consumer electronics working experience;
- Working experience in fast pace semi-conductor manufacturing environment;
- Process a good sense of responsibility and positive working attitude;
- Good written and oral communications skills;
- Able to understand, debug, modify and improve test program.
职位描述
- Define and develop package solution for high speed, high power and large pin count device in a cross-function team;
- Design rule development and implementation of in-house packaging layout to meet product requirements;
- Interface with vendors on process optimization, chip characterization and failure analysis for volume production;
- PI/SI analysis on full chip and critical IPs at package level;
- Drive new technology development such as multi-die, advanced substrate, design for manufacturability and design for reliability, as a collaborative effort with vendors.
岗位要求
- Education: Bachelor Degree or above, Master is preferred. Major in Electrical Engineering/Microwave/Microelectronics/Physics etc.;
- Hands on experiences with layout of FCBGA, MCM, SiP, WLBGA etc and optimization for ball count and power grid;
- Experience on design of very large form factor flip chip package with high substrate layer count;
- Experience with high-speed IO interfaces design and PI/SI analysis, such as DDR and PCIe is preferred;
- Experience on mechanical and thermal analysis and control, knowledge on mechanical and thermal reliability is a plus;
- Capability of driving package roadmap to meet future products on advanced nodes.