Advanced Memory Buffer

Montage dedicates to developing and delivering Advanced Memory Buffer (AMB), the key device of the emerging Fully Buffered Dual In-Line Memory Modules (FB-DIMMs). FB-DIMM introduces a new architecture to solve the capacity-throughput bottleneck in the conventional memory systems, enabling high-speed, large-capacity memory solution for next-generation servers and workstations.

The FB-DIMM architecture uses a high-speed, serial, point-to-point connection between the memory controller and modules on the channel. The AMB chip located on each FB-DIMM handles the channel and memory requests to and from the local DIMM, and forwards the requests to the next DIMM or the memory controller. This architecture eliminates the resistance incontinuity issue with registered or unbuffered DIMMs at high memory densities, enabling increased bandwidths and large memory capacities characteristic for high-performance platforms.

Montage, by combining its expertise in high-speed and low-power mixed-signal IC design technology, provides a high-quality, cost-effective AMB product with extra low power. Montage's AMB is fully complaint with JEDEC specifications. It incorporates CRC protection and bit lane fail-over features to reduce system down-time, and implements rich built-in DFx (Design for Test) features to help with DRAM, DIMM and memory system test. The first generation AMB allows direct connection to DDR2-533, DDR2-667 or DDR2-800 commodity DRAM devices, supporting channel bit rate up to 4.8 GB/s.

For detailed information about the products, please contact Montage Sales.

Tel: +86 21 51696833
Email: sales@montage-tech.com