About Montage About Montage
About Montage
公司介绍
About Us

Founded in 2004, Montage Technology is a globally leading fabless IC design company, dedicated to providing innovative, reliable and power-efficient interconnect solutions for cloud computing and AI infrastructure. The company currently has two major product lines: interconnect chips and Jintide® server platform.

Montage Technology was listed on the Shanghai Stock Exchange in July 2019 as one of the first companies on the STAR Market, with stock code 688008. In February 2026, it was also listed on the Main Board of the Hong Kong Stock Exchange, with stock code 6809. The company is headquartered in Shanghai and has branch offices in Kunshan,  Xi'an, Zhuhai, Hangzhou, Nanjing, Beijing, Hainan, Macao SAR, as well as in the United States and South Korea.

Corporate Culture
  • MISSION
    Accelerate the AI era with innovative interconnect solutions
    MISSION
  • VISION
    Be a global leader in interconnect semiconductor solutions
    VISION
  • Culture
    Accelerating with focus & innovation
    Culture
Company Milestones
2026

Listed on the Main Board of the Hong Kong Stock Exchange

2025

Introduced PCIe 6.x / CXL 3.x Retimer

Successfully sampled DDR5 Gen2 MRCD/MDB chips

Introduced CXL 3.1 MXC

Successfully mass-produced Gen4 DDR5 RCD chips

2024

MRCD/MDB and CKD chips entered scale trial production

PCIe Retimer cumulative shipments exceeded one million units

2023

Started the mass production of PCIe 5.0/CXL 2.0 Retimer

Among the world's first batch of suppliers to enter the CXL integrators list

Pioneered trial production of Gen3 DDR5 RCD chips

2022

Released the world's first CXL Memory eXpander Controller (MXC) chips

Pioneered trial production of Gen2 DDR5 RCD chips

Successfully sampled Gen1 DDR5 CKD chips

2021

Elected to the JEDEC Board of Directors

Achieved the mass production and shipment of Gen1 DDR5 memory interface chips and module supporting chips

2020

Achieved the mass production of PCIe 4.0 Retimer chips

2019

Listed on the SSE STAR Market as one of the first companies

2014

Won GSA Award for Best Financially Managed Semiconductor Company

2013

DDR4 Registering Clock Driver (RCD) and Data Buffer chips were certified

2011

DDR3 Register Buffer and Memory Buffer chips were certified

2008

DDR2 Advanced Memory Buffer (AMB) chips were certified

2006

Started mass production of the first chip

Obtained its first granted invention patent

2004

Montage Technology was founded

Core Advantages
Core Advantages
Building a Complete Technology Chain to Provide System-Level Solutions Building a Complete Technology Chain to Provide System-Level Solutions
Building a Complete Technology Chain to Provide System-Level Solutions
Montage Technology has built a complete product portfolio covering memory interconnect, PCIe/CXL interconnect, clock chips, and server CPUs, achieving multi-level technology integration. The company continues to lead innovation and evolution in memory interface technology, holding significant influence in the development of international standards for memory interface products. In the field of PCIe high-speed interconnect, leveraging its self-developed high-speed SerDes technology, Montage offers more competitive products and solutions. Through the synergistic integration of diverse core technologies, Montage delivers high-performance, high-reliability system-level solutions to customers, helping them optimize overall costs.
Leading Technological Standards and Driving Industry Evolution Leading Technological Standards and Driving Industry Evolution
Leading Technological Standards and Driving Industry Evolution
Montage Technology has always been at the forefront of technological innovation. As an international standard-setter in the memory interconnect field, the company not only led the development of international standards for DDR5 RCD, MDB, and CKD chips but has also been dedicated to promoting the industrialization of advanced interconnect technologies such as DDR5, PCIe, and CXL. Through continuous high investment in R&D, we constantly introduce innovative products with industry impact, providing core momentum for the evolution of global digital infrastructure.
Building an Open Ecosystem and Fostering Collaborative Innovation Building an Open Ecosystem and Fostering Collaborative Innovation
Building an Open Ecosystem and Fostering Collaborative Innovation
Montage Technology consistently adheres to an open and collaborative ecosystem strategy, working with partners across the industrial chain to promote the development of technical standards and industrial synergy. Our products maintain compatibility with mainstream hardware platforms, operating systems, and application ecosystems. By actively participating in technical collaborations and international standard organizations and industry alliances such as PCI-SIG, CXL, and UALink, we continuously expand our industry influence and provide customers with more valuable end-to-end solutions.
Awards & Honors
Awards & Honors
Nov 2025
Forbes China Top 50 Most Innovative Companies
Aug 2025
Fortune China Top 50 Tech Companies
Nov 2023
Outstanding Supplier Performance Award (Micron)
Dec 2020
Award of Excellence (SK hynix)
Feb 2018
Best Contribution Award (Samsung)
Dec 2014
Best Financially Managed Semiconductor Company (GSA)
Montage Technology's ESG Governance
Montage Technology's ESG Governance

As a globally leading fabless IC design company, Montage Technology integrates ESG principles into its corporate governance and strategic goals, establishing a three-tier ESG governance structure – Board, Management, and Execution – with a Strategy and ESG Committee at the Board level to steer the ESG direction. We value close collaboration with stakeholders and embrace a shared-growth philosophy. We continuously strengthen internal controls and risk management to foster a transparent, ethical, and resilient business environment.